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OverviewThis edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices, and technology options. The chapters are a ""walk-through"" of the actual assembly process. A new chapter discusses the effect of high pin count devices (fine pitch, BGA, and PGA) and their impact on board assembly. Expanded coverage of water soluble paste, no clean paste, and lead free solder addresses the environmental issues current to the industry. Full Product DetailsAuthor: Ray PrasadPublisher: Chapman and Hall Imprint: Chapman and Hall Edition: Second Edition 1997 Dimensions: Width: 15.50cm , Height: 4.20cm , Length: 23.50cm Weight: 2.850kg ISBN: 9780412129216ISBN 10: 0412129213 Pages: 772 Publication Date: 31 March 1997 Audience: College/higher education , Professional and scholarly , Postgraduate, Research & Scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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