Electronics Reliability and Measurement Technology: Nondestructive Evaluation
Author:   Joseph S. Heyman ,  Joseph S. Heyman
Publisher:   William Andrew Publishing
ISBN:  

9780815511717


Pages:   140
Publication Date:   31 December 1998
Format:   Hardback
Availability:   In Print   Availability explained
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

Our Price $382.80 Quantity:  
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Electronics Reliability and Measurement Technology: Nondestructive Evaluation


Overview

This book examines electronic reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots. Contents include: Measurement Science and Manufacturing Science research Nondestructive SEM for Surface and Subsurface Wafer Imaging Surface Inspection - Research and Development Sensors Development for In-Process Thermal Sensing and Imaging Wafer level Reliability for High Performance VLSI Design Micro-Focus X-ray imaging Measurement of Opaque Film Thickness Intelligent Laser Soldering Inspection and Process Control.

Full Product Details

Author:   Joseph S. Heyman ,  Joseph S. Heyman
Publisher:   William Andrew Publishing
Imprint:   William Andrew Publishing
Dimensions:   Width: 15.20cm , Height: 0.90cm , Length: 22.90cm
Weight:   0.490kg
ISBN:  

9780815511717


ISBN 10:   081551171
Pages:   140
Publication Date:   31 December 1998
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Out of Print
Availability:   In Print   Availability explained
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

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