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OverviewFull Product DetailsAuthor: John H. LauPublisher: Springer Verlag, Singapore Imprint: Springer Verlag, Singapore Edition: 1st ed. 2023 Weight: 1.080kg ISBN: 9789811999161ISBN 10: 9811999163 Pages: 525 Publication Date: 28 March 2023 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsReviewsAuthor InformationFor Internal Use Only: John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow Unimicron Technology Corporation, John_Lau@unimicron.com SPECIALIZED PROFESSIONAL COMPETENCIES [1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability. [2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging. [3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers. Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures. Tab Content 6Author Website:Countries AvailableAll regions |
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