Chip On Board: Technology for Multichip Modules
Author:   John H. Lau
Publisher:   Kluwer Academic Publishers Group
Edition:   1994 ed.
ISBN:  

9780442014414


Pages:   556
Publication Date:   30 June 1994
Format:   Hardback
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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Chip On Board: Technology for Multichip Modules


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Full Product Details

Author:   John H. Lau
Publisher:   Kluwer Academic Publishers Group
Imprint:   Kluwer Academic Publishers
Edition:   1994 ed.
Dimensions:   Width: 15.50cm , Height: 3.10cm , Length: 23.50cm
Weight:   2.170kg
ISBN:  

9780442014414


ISBN 10:   0442014414
Pages:   556
Publication Date:   30 June 1994
Audience:   College/higher education ,  General/trade ,  Undergraduate ,  General
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

Preface; Acknowledgments; A brief introduction to wire bonding, tape automated bonding, and flip chip on board for multichip module applications; Making COB testing tractable: chip pretest and system diagnostics; Chip level interconnect; wire bonding for multichip modules; Chip level interconnect: wafer bumping and inner lead bonding; Chip level interconnect: solder bumped flip chip; Chip attachment; Wire bonding chip on board; Tape automated bonding chip on board and on MCM-D; Solder bumped flip chip attach on SLC board and multichip module; Micron bump bonding chip on board; chip on board encapsulation; Underfill encapsulation for flip chip applications; Index

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