Overview

With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This text serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves. The book should be of interest to electrical and mechanical engineers and designers specializing in electronic packaging from the die level through the systems level; microelectronics packaging specialists and technicians; and engineers and designers interested in convective heat transfer.

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9780412122712

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