Wireless Interface Technologies for 3D IC and Module Integration
Author:   Tadahiro Kuroda (University of Tokyo) ,  Wai-Yeung Yip (University of Tokyo)
Publisher:   Cambridge University Press
ISBN:  

9781108841214


Pages:   336
Publication Date:   30 September 2021
Format:   Hardback
Availability:   Manufactured on demand   Availability explained
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Wireless Interface Technologies for 3D IC and Module Integration


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Author:   Tadahiro Kuroda (University of Tokyo) ,  Wai-Yeung Yip (University of Tokyo)
Publisher:   Cambridge University Press
Imprint:   Cambridge University Press
Dimensions:   Width: 17.70cm , Height: 2.40cm , Length: 25.10cm
Weight:   0.752kg
ISBN:  

9781108841214


ISBN 10:   110884121
Pages:   336
Publication Date:   30 September 2021
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

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Tadahiro Kuroda is Professor and Founding Director at the Systems Design Lab at the University of Tokyo. He is a Fellow of the IEICE and the IEEE. Wai-Yeung Yip is a Researcher at the University of Tokyo with over twenty-five years of industry experience in high-speed chip interface design.

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