Variation Tolerant On-Chip Interconnects

Author:   Ethiopia Enideg Nigussie
Publisher:   Springer-Verlag New York Inc.
Edition:   2012
ISBN:  

9781461401308


Pages:   172
Publication Date:   01 December 2011
Format:   Hardback
Availability:   Manufactured on demand   Availability explained
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Variation Tolerant On-Chip Interconnects


Overview

This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems.

Full Product Details

Author:   Ethiopia Enideg Nigussie
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   2012
Dimensions:   Width: 15.50cm , Height: 1.30cm , Length: 23.50cm
Weight:   0.448kg
ISBN:  

9781461401308


ISBN 10:   1461401305
Pages:   172
Publication Date:   01 December 2011
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Introduction.- On-Chip Communication.- Interconnect Design Techniques.- Design of Delay-Insensitive Current Sensing Interconnects.- Enhancing Completion Detection Performance.- Energy Efficient Semi-Serial Interconnect.- Comparison of the Designed Interconnects.- Circuit Techniques for PVT Variation Tolerance.

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Author Information

Introduction.- Interconnect Design Techniques.- On-Chip Wire Modeling.- Design of Delay-Insensitive Current Sensing Interconnects.- Enhancing Completion Detection Performance.- Energy Efficient Semi-Serial Interconnect.- Comparison of the Designed Interconnects.- Circuit Techniques for PVT Variation Tolerance.

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