Overview

Current integrated optics platforms fabricated using glass, semi-conductors and polymers cannot accommodate the variety of materials needed in many optical systems and are limited in flexibility by the two-dimensional nature of the fabrication processes. This thesis proposes a novel three-dimensional (3D) approach to integrated optics that uses a volume photopolymer to encapsulate the various components necessary in an optical system. The components are then connected with waveguides that are fabricated using a 3D direct-write lithography system capable of writing deeply-buried, localized index structures into the diffusion-mediated photopolymers. This thesis demonstrates waveguides written both perpendicular and parallel to the writing beam using low power, continuous wave lasers. Because quantitative imaging of these weak, deeply buried, micron-scale index structures cannot be obtained with standard microscopy methods, I will also present a modified optical diffraction tomography system capable of these measurements. Quantitative 3D images of these weak index structures are constructed by replicating the structure to be measured to form a diffraction grating. The coherent addition of scattering from each of these objects increases the sensitivity of the imaging system. The combination of this 3D imaging system with the 3D direct write lithography system provides the ability to characterize and optimize index structures written into the volume photopolymer in order to write uniform, tapered and single mode waveguides.

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9781243430571

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