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9783668211384

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wissenschaftliche Veroffentlichungen: Konferenzbeitrage: 2014 P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, -TSV-Annealing  A thermo-mechanical assessment, - in Electronics System-Integration Technology Conference (ESTC), 2014, pp. 1-6. 2013 P. Saettler, M. Boettcher, C. Rudolph, and K. J. Wolter, -Bath chemistry and copper overburden as influencing factors of the TSV annealing, - in Proceedings - Electronic Components and Technology Conference, 2013, pp. 1753-1758. P. Saettler, M. Boettcher, and K. J. Wolter, --Raman spectroscopy and FE-analysis of thermo-mechanical stresses in TSV periphery, - in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013, 2013, pp. 1-7. 2012 P. Saettler, M. Boettcher, and K. J. Wolter, -Characterization of the annealing behavior for copper-filled TSVs, - in Proceedings - Electronic Components and Technology Conference, 2012, pp. 619-624. P. Saettler, D. Kovalenko, K. Meier, M. Roellig, M. Boettcher, and K. J. Wolter, -Thermo-mechanical characterization and modeling of TSV annealing behavior, - in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 2012, pp. 1/6-6/6. 2011 P. Saettler, K. Meier, and K. J. Wolter, -Considering copper anisotropy for advanced TSV-modeling, - in Proceedings of the International Spring Seminar on Electronics Technology, 2011, pp. 419-423. Fachzeitschriften: 2015 P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, --Raman Spectroscopy and FE-Modeling for TSV-Stress-Characterization, - Microelectron. Eng., pp. 1-7, 2015. 2013 P. Saettler, M. Boettcher, C. Rudolph, and K.-J. Wolter, -Thermo-mechanische Charakterisierung des TSV-Annealing, - Produktion von Leiterplatten und Syst., no. 7, pp. 1498-1507, 2013.

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