Overview

Thermal Design: Heat Sinks, Thermoelectrics, Heat Pipes, Compact Heat Exchangers, and Solar Cells, Second Edition, is a significantly updated new edition which now includes a chapter on thermoelectrics It covers thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. The underlying concepts in this book cover the understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and also the design of the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. This new edition includes more examples, problems and tutorials, and a solutions manual is available on a companion website.

Full Product Details

Author:   HS Lee
Publisher:   John Wiley and Sons Ltd
Imprint:   John Wiley & Sons Ltd
Dimensions:   Width: 19.70cm , Height: 3.90cm , Length: 23.60cm
Weight:   1.208kg
ISBN:  

9780470496626

ISBN 10:   0470496622
Pages:   656
Publication Date:   22 December 2010
Audience:   College/higher education ,  Undergraduate ,  Postgraduate, Research & Scholarly
Replaced By:   9781119685975
Format:   Hardback
Publisher's Status:   Unknown
Availability:   In Print  
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

Table of Contents

Preface xv 1 Introduction 1 1.1 Introduction 1 1.2 Humans and Energy 1 1.3 Thermodynamics 2 1.3.1 Energy, Heat, and Work 2 1.3.2 The First Law of Thermodynamics 2 1.3.3 Heat Engines, Refrigerators, and Heat Pumps 5 1.3.4 The Second Law of Thermodynamics 7 1.3.5 Carnot Cycle 7 1.4 Heat Transfer 11 1.4.1 Introduction 11 1.4.2 Conduction 12 1.4.3 Convection 15 1.4.3.1 Parallel Flow on an Isothermal Plate 15 1.4.3.2 A Cylinder in Cross Flow 18 1.4.3.3 Flow in Ducts 18 1.4.3.4 Free Convection 22 1.4.4 Radiation 25 1.4.4.1 Thermal Radiation 25 1.4.4.2 View Factor 29 1.4.4.3 Radiation Exchange between Diffuse-Gray Surfaces 31 References 32 2 Heat Sinks 34 2.1 Longitudinal Fin of Rectangular Profile 34 2.2 Heat Transfer from Fin 36 2.3 Fin Effectiveness 37 2.4 Fin Efficiency 38 2.5 Corrected Profile Length 38 2.6 Optimizations 39 2.6.1 Constant Profile Area Ap 39 2.6.2 Constant Heat Transfer from a Fin 41 2.6.3 Constant Fin Volume or Mass 42 2.7 Multiple Fin Array I 45 2.7.1 Free (Natural) Convection Cooling 45 2.7.1.1 Small Spacing Channel 45 2.7.1.2 Large Spacing Channel 48 2.7.1.3 Optimum Fin Spacing 49 2.7.2 Forced Convection Cooling 49 2.7.2.1 Small Spacing Channel 49 2.7.2.2 Large Spacing Channel 51 2.8 Multiple Fin Array II 53 2.8.1 Natural (Free) Convection Cooling 55 2.9 Thermal Resistance and Overall Surface Efficiency 56 2.10 Fin Design with Thermal Radiation 80 2.10.1 Single Longitudinal Fin with Radiation 81 References 94 Problems 94 3 Thermoelectrics 100 3.1 Introduction 100 3.2 Thermoelectric Effect 102 3.2.1 Seebeck Effect 102 3.2.2 Peltier Effect 103 3.2.3 Thomson Effect 103 3.2.4 Thomson (or Kelvin) Relationships 103 3.3 Thermoelement Couple (Thermocouple) 104 3.4 The Figure of Merit 104 3.5 Similar and Dissimilar Materials 105 3.5.1 Similar Materials 105 3.5.2 Dissimilar Materials 106 3.6 Thermoelectric Generator (TEG) 107 3.6.1 Similar and Dissimilar Materials 107 3.6.1.1 Similar Materials 107 3.6.1.2 Dissimilar Materials 108 3.6.2 Conversion Efficiency and Current 109 3.6.3 Maximum Conversion Efficiency 109 3.6.4 Maximum Power Efficiency 111 3.6.5 Maximum Performance Parameters 112 3.6.6 Multicouple Modules 115 3.7 Thermoelectric Coolers (TEC) 126 3.7.1 Similar and Dissimilar Materials 127 3.7.1.1 Similar Materials 127 3.7.1.2 Dissimilar Materials 128 3.7.2 The Coefficient of Performance 128 3.7.3 Optimum Current for the Maximum Cooling Rate 129 3.7.4 Maximum Performance Parameters 129 3.7.5 Optimum Current for the Maximum COP 130 3.7.6 Generalized Charts 131 3.7.7 Optimum Geometry for the Maximum Cooling in Similar Materials 132 3.7.8 Thermoelectric Modules 133 3.7.9 Commercial TEC 135 3.7.10 Multistage Modules 135 3.7.10.1 Commercial Multistage Peltier Modules 137 3.7.11 Design Options 137 3.8 Applications 142 3.8.1 Thermoelectric Generators 142 3.8.2 Thermoelectric Coolers 143 3.9 Design Example 143 3.9.1 Design Concept 144 3.9.2 Design of Internal and External Heat Sinks 145 3.9.3 Design of Thermoelectric Cooler (TEC) 149 3.9.4 Finding the Exact Solution for Tc and Th 150 3.9.5 Performance Curves for Thermoelectric Air Cooler 152 3.10 Thermoelectric Module Design 153 3.10.1 Thermal and Electrical Contact Resistances for TEG 153 3.10.2 Thermal and Electrical Contact Resistances for TEC 158 3.11 Design Example of TEC Module 166 3.11.1 Design Concept 166 3.11.2 Summary of Design of a TEC Module 173 References 174 Problems 175 4 Heat Pipes 180 4.1 Operation of Heat Pipe 180 4.2 Surface Tension 181 4.3 Heat Transfer Limitations 183 4.3.1 Capillary Limitation 184 4.3.1.1 Maximum Capillary Pressure Difference 185 4.3.1.2 Vapor Pressure Drop 187 4.3.1.3 Liquid Pressure Drop 189 4.3.1.4 Normal Hydrostatic Pressure Drop 189 4.3.1.5 Axial Hydrostatic Pressure Drop 191 4.3.2 Approximation for Capillary Pressure Difference 191 4.3.3 Sonic Limitation 192 4.3.4 Entrainment Limitation 192 4.3.5 Boiling Limitation 193 4.3.6 Viscous Limitation 193 4.4 Heat Pipe Thermal Resistance 197 4.4.1 Contact Resistance 200 4.5 Variable Conductance Heat Pipes (VCHP) 202 4.5.1 Gas-Loaded Heat Pipes 203 4.5.2 Clayepyron-Clausius Equation 205 4.5.3 Applications 206 4.6 Loop Heat Pipes 208 4.7 Micro Heat Pipes 210 4.7.1 Steady-State Models 211 4.7.1.1 Conventional Model 211 4.7.1.2 Cotter’s Model 212 4.8 Working Fluid 217 4.8.1 Figure of Merit 217 4.8.2 Compatibility 219 4.9 Wick Structures 219 4.10 Design Example 221 4.10.1 Selection of Material and Working Fluid 221 4.10.2 Working Fluid Properties 221 4.10.3 Estimation of Vapor Space Radius 223 4.10.4 Estimation of Operating Limits 223 4.10.4.1 Capillary Limits 223 4.10.4.2 Sonic Limits 223 4.10.4.3 Entrainment Limits 224 4.10.4.4 Boiling Limits 225 4.10.5 Wall Thickness 226 4.10.6 Wick Selection 227 4.10.7 Maximum Arterial Depth 229 4.10.8 Design of Arterial Wick 230 4.10.9 Capillary Limitation 230 4.10.9.1 Liquid Pressure Drop in the Arteries 231 4.10.9.2 Liquid Pressure Drop in the Circumferential Wick 232 4.10.9.3 Vapor Pressure Drop in the Vapor Space 232 4.10.10 Performance Map 234 4.10.11 Check the Temperature Drop 235 References 236 Problems 237 5 Compact Heat Exchangers 240 5.1 Introduction 240 5.2 Fundamentals of Heat Exchangers 243 5.2.1 Counterflow and Parallel Flows 243 5.2.2 Overall Heat Transfer Coefficient 245 5.2.3 Log Mean Temperature Difference (LMTD) 247 5.2.4 Flow Properties 249 5.2.5 Nusselt Numbers 250 5.2.6 Effectiveness–NTU (ε-NTU) Method 250 5.2.6.1 Parallel Flow 252 5.2.6.2 Counterflow 253 5.2.6.3 Crossflow 253 5.2.7 Heat Exchanger Pressure Drop 257 5.2.8 Fouling Resistances (Fouling Factors) 261 5.2.9 Overall Surface (Fin) Efficiency 262 5.2.10 Reasonable Velocities of Various Fluids in Pipe Flow 264 5.3 Double-Pipe Heat Exchangers 265 5.4 Shell-and-Tube Heat Exchangers 272 5.4.1 Baffles 273 5.4.2 Multiple Passes 273 5.4.3 Dimensions of Shell-and-Tube Heat Exchanger 274 5.4.4 Shell-side Tube Layout 274 5.5 Plate Heat Exchangers (PHE) 285 5.5.1 Flow Pass Arrangements 285 5.5.2 Geometric Properties 286 5.5.3 Friction Factor 290 5.5.4 Nusselt Number 290 5.5.5 Pressure Drops 290 5.6 Pressure Drops in Compact Heat Exchangers 303 5.6.1 Fundamentals of Core Pressure Drop 304 5.6.2 Core Entrance and Exit Pressure Drops 306 5.6.3 Contraction and Expansion Loss Coefficients 307 5.6.3.1 Circular-Tube Core 308 5.6.3.2 Square-Tube Core 309 5.6.3.3 Flat-Tube Core 310 5.6.3.4 Triangular-Tube Core 311 5.7 Finned-Tube Heat Exchangers 312 5.7.1 Geometrical Characteristics 313 5.7.2 Flow Properties 315 5.7.3 Thermal Properties 315 5.7.4 Correlations for Circular Finned-Tube Geometry 316 5.7.5 Pressure Drop 317 5.7.6 Correlations for Louvered Plate-Fin Flat-Tube Geometry 318 5.8 Plate-Fin Heat Exchangers 332 5.8.1 Geometric Characteristics 333 5.8.2 Correlations for Offset Strip Fin (OSF) Geometry 335 5.9 Louver-Fin-Type Flat-Tube Plate-Fin Heat Exchangers 352 5.9.1 Geometric Characteristics 352 5.9.2 Correlations for Louver Fin Geometry 355 References 372 Problems 373 6 Solar Cells 382 6.1 Introduction 382 6.1.1 Operation of Solar Cells 384 6.1.2 Solar Cells and Technology 386 6.1.3 Solar Irradiance 387 6.1.4 Air Mass 388 6.1.5 Nature of Light 389 6.2 Quantum Mechanics 390 6.2.1 Atomic Structure 392 6.2.2 Bohr’s Model 393 6.2.3 Line Spectra 394 6.2.4 De Broglie Wave 396 6.2.5 Heisenberg Uncertainty Principle 397 6.2.6 Schrodinger Equation 397 6.2.7 A Particle in a 1-D Box 398 6.2.8 Quantum Numbers 401 6.2.9 Electron Configurations 403 6.2.10 Van der Waals Forces 405 6.2.11 Covalent Bonding 405 6.2.12 Energy Band 406 6.2.13 Pseudo-Potential Well 407 6.3 Density of States 408 6.3.1 Number of States 408 6.3.2 Effective Mass 409 6.4 Equilibrium Intrinsic Carrier Concentration 409 6.4.1 Fermi Function 410 6.4.2 Nondegenerate Semiconductor 411 6.4.3 Equilibrium Electron and Hole Concentrations 411 6.4.4 Intrinsic Semiconductors 413 6.4.5 Intrinsic Carrier Concentration, ni 414 6.4.6 Intrinsic Fermi Energy 415 6.4.7 Alternative Expression for n0 and p0 416 6.5 Extrinsic Semiconductors in Thermal Equilibrium 416 6.5.1 Doping, Donors, and Acceptors 417 6.5.2 Extrinsic Carrier Concentration in Equilibrium 418 6.5.3 Built-in Voltage 420 6.5.4 Principle of Detailed Balance 421 6.5.5 Majority and Minority Carriers in Equilibrium 421 6.6 Generation and Recombination 422 6.6.1 Direct and Indirect Band Gap Semiconductors 422 6.6.2 Absorption Coefficient 424 6.6.3 Photogeneration 424 6.7 Recombination 425 6.7.1 Recombination Mechanisms 425 6.7.2 Band Energy Diagram under Nonequilibrium Conditions 427 6.7.2.1 Back Surface Field (BSF) 427 6.7.3 Low-Level Injection 429 6.7.3.1 Low-Level Injection 429 6.7.4 Band-to-Band Recombination 430 6.7.5 Trap-Assisted (SRH) Recombination 431 6.7.6 Simplified Expression of the SRH Recombination Rate 433 6.7.7 Auger Recombination 434 6.7.8 Total Recombination Rate 435 6.8 Carrier Transport 436 6.8.1 Drift 436 6.8.2 Carrier Mobility 436 6.8.3 Diffusion 437 6.8.4 Total Current Densities 438 6.8.5 Einstein Relationship 439 6.8.6 Semiconductor Equations 440 6.8.7 Minority-Carrier Diffusion Equations 440 6.8.8 P–n Junction 441 6.8.9 Calculation of Depletion Width 444 6.8.10 Energy Band Diagram with a Reference Point 445 6.8.11 Quasi-Fermi Energy Levels 446 6.9 Minority Carrier Transport 447 6.9.1 Boundary Conditions 448 6.9.2 Minority Carrier Lifetimes 449 6.9.3 Minority Carrier Diffusion Lengths 450 6.9.4 Minority Carrier Diffusion Equation for Holes 450 6.9.5 Minority Carrier Diffusion Equation for Electrons 454 6.10 Characteristics of Solar Cells 457 6.10.1 Current Density 457 6.10.2 Current-Voltage Characteristics 463 6.10.3 Figures of Merit 466 6.10.4 Effect of Minority Electron Lifetime on Efficiency 468 6.10.5 Effect of Minority Hole Lifetime on Efficiency 470 6.10.6 Effect of Back Surface Recombination Velocity on Efficiency 470 6.10.7 Effect of Base Width on Efficiency 471 6.10.8 Effect of Emitter Width WN on Efficiency 472 6.10.9 Effect of Acceptor Concentration on Efficiency 474 6.10.10 Effect of Donor Concentration on Efficiency 475 6.10.11 Band Gap Energy with Temperature 476 6.10.12 Effect of Temperature on Efficiency 477 6.11 Additional Topics 478 6.11.1 Parasitic Resistance Effects (Ohmic Losses) 478 6.11.2 Quantum Efficiency 481 6.11.3 Ideal Solar Cell Efficiency 483 6.12 Modeling 488 6.12.1 Modeling for a Silicon Solar Cell 488 6.12.2 Comparison of the Solar Cell Model with a Commercial Product 503 6.13 Design of a Solar Cell 506 6.13.1 Solar Cell Geometry with Surface Recombination Velocities 506 6.13.2 Donor and Acceptor Concentrations 507 6.13.3 Minority Carrier Diffusion Lifetimes 507 6.13.4 Grid Spacing 508 6.13.5 Anti-Reflection, Light Trapping and Passivation 512 References 512 Problems 513 Appendix A Thermophysical Properties 518 Appendix B Thermoelectrics 561 B.1 Thermoelectric Effects 561 Seebeck Effect 561 Peltier Effect 562 Thomson Effect 562 B.2 Thomson (or Kelvin) Relationships 562 B.3 Heat Balance Equation 566 B.4 Figure of Merit and Optimum Geometry 568 References 573 Appendix C Pipe Dimensions 574 Appendix D Curve Fitting of Working Fluids 576 Curve Fit for Working Fluids Chosen 576 D.1 Curve Fitting for Working Fluid Properties Chosen 576 D.1.1 MathCad Format 576 Appendix E Tutorial I for 2-D 580 Problem Description for Tutorial I 580 E.1 Tutorial I: Using Gambit and Fluent for Thermal Behavior of an Electrical Wire 581 E.1.1 Creating Geometry in Gambit 581 E.2 Calculations for Heat Generation 588 Appendix F Tutorial II for 3-D 590 Problem Description for Tutorial II 590 F.1 Tutorial II Double-Pipe Heat Exchanger: Using SolidWorks, Gambit, and Fluent 591 F.1.1 Double-Pipe Heat Exchanger 591 F.1.2 Construct Model in SolidWorks 591 F.1.3 Meshing the Double Pipe Heat Exchanger in Gambit 595 F.1.4 Analysis of Heat Exchanger in Fluent 600 Appendix G Computational Work of Heat Pipe 605 G.1 A Heat Pipe and Heat Sink 605 Appendix H Computational Work of a Heat Sink 607 H.1 Electronic Package Cooling 607 Appendix I Tutorial for MathCAD 608 I.1 Tutorial Problem for MathCAD 608 Index 613

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HoSung Lee, PhD, is Professor of Mechanical and Aeronautical Engineering at Western Michigan University.

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