Thermal Contact Conductance

Author:   Chakravarti V. Madhusudana
Publisher:   Springer International Publishing AG
Edition:   Softcover reprint of the original 2nd ed. 2014
ISBN:  

9783319374284


Pages:   260
Publication Date:   23 August 2016
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Thermal Contact Conductance


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Full Product Details

Author:   Chakravarti V. Madhusudana
Publisher:   Springer International Publishing AG
Imprint:   Springer International Publishing AG
Edition:   Softcover reprint of the original 2nd ed. 2014
Dimensions:   Width: 15.50cm , Height: 1.50cm , Length: 23.50cm
Weight:   4.277kg
ISBN:  

9783319374284


ISBN 10:   3319374281
Pages:   260
Publication Date:   23 August 2016
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Introduction.- Thermal Constriction Resistance.- Solid Spot Thermal Conductance of a Joint.- Gap Conductance at the Interface.-Experimental Aspects.- Special Configurations and Processes.- Control of Thermal Contact Conductance Using Interstitial Materials and Coatings.- Major Applications.- Additional Topics.- Concluding Remarks.

Reviews

Reviewer 1: The composition of the book follows a classic outline. It includes comprehensive theoretical insight into the phenomenon of TCC which establishes the links between the main physical characteristics determining TCC (properties of materials, surfaces and interstitial media), in the form of non-dimensional correlations. This allows the author to present TCC for variety of different materials in a simple form. It provides a summary of the experimental methods, collates and classifies information on the performance of different joints, hereby giving a useful update on the status of the field over half a century. Thus, the book is a good source of basic academic knowledge on TCC. Reviewer 2: This book would most certainly serve as a reference book; libraries of universities from all over the world should certainly buy it. Students can use it to learn the basic analytical methods and the experimental set-ups used. Reviewer 3: The whole style of this book, including illustrations is used very well. The examples are very vivid. It is easy to understand for machinery and materials processing engineering undergraduate students and masters.


Reviewer 1: The composition of the book follows a classic outline. It includes comprehensive theoretical insight into the phenomenon of TCC which establishes the links between the main physical characteristics determining TCC (properties of materials, surfaces and interstitial media), in the form of non-dimensional correlations. This allows the author to present TCC for variety of different materials in a simple form. It provides a summary of the experimental methods, collates and classifies information on the performance of different joints, hereby giving a useful update on the status of the field over half a century. Thus, the book is a good source of basic academic knowledge on TCC.   Reviewer 2: This book would most certainly serve as a reference book; libraries of universities from all over the world should certainly buy it. Students can use it to learn the basic analytical methods and the experimental set-ups used.   Reviewer 3: The whole style of this book, including illustrations is used very well.  The examples are very vivid.  It is easy to understand for machinery and materials processing engineering undergraduate students and masters.


Reviewer 1: The composition of the book follows a classic outline. It includes comprehensive theoretical insight into the phenomenon of TCC which establishes the links between the main physical characteristics determining TCC (properties of materials, surfaces and interstitial media), in the form of non-dimensional correlations. This allows the author to present TCC for variety of different materials in a simple form. It provides a summary of the experimental methods, collates and classifies information on the performance of different joints, hereby giving a useful update on the status of the field over half a century. Thus, the book is a good source of basic academic knowledge on TCC. Reviewer 2: This book would most certainly serve as a reference book; libraries of universities from all over the world should certainly buy it. Students can use it to learn the basic analytical methods and the experimental set-ups used. Reviewer 3: The whole style of this book, including illustrations is used very well. The examples are very vivid. It is easy to understand for machinery and materials processing engineering undergraduate students and masters.


Author Information

Professor Madhusudana is currently working out of Sudney, Australia

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