The Mechanics and Reliability of Films, Multilayers and Coatings

Author:   Matthew R. Begley (University of California, Santa Barbara) ,  John W. Hutchinson (Harvard University, Massachusetts)
Publisher:   Cambridge University Press
ISBN:  

9781107131866


Pages:   288
Publication Date:   24 March 2017
Format:   Hardback
Availability:   Manufactured on demand   Availability explained
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The Mechanics and Reliability of Films, Multilayers and Coatings


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Author:   Matthew R. Begley (University of California, Santa Barbara) ,  John W. Hutchinson (Harvard University, Massachusetts)
Publisher:   Cambridge University Press
Imprint:   Cambridge University Press
Dimensions:   Width: 18.20cm , Height: 1.70cm , Length: 26.00cm
Weight:   0.740kg
ISBN:  

9781107131866


ISBN 10:   1107131863
Pages:   288
Publication Date:   24 March 2017
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

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Professor Matthew R. Begley is recognized for seminal contributions in the mechanics of multilayered systems, with an emphasis on computational aspects of the required analysis. His codes are employed in some industries to design experiments, assess current designs and evaluate novel multilayer systems for improved performance. He is widely sought after for consulting work on the mechanics of thin films, coatings and multilayers, by companies such as General Electric, Pratt and Whitney, Intel, Sunpower, Raytheon and Areva. Professor John W. Hutchinson is a member of the US National Academies of Engineering and Sciences and a Foreign Member of the Royal Society of London. He is one of the leading experts in the mechanics of thin film systems, with a number of highly cited, seminal journal papers on the subject. Hutchinson is credited with generating many of the conceptual developments in this field, as well as illustrations of those concepts to applications such as microelectronics, thermal barrier coatings, microfluidic devices and hypersonics.

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