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OverviewFull Product DetailsAuthor: Michael Pecht (University of Maryland, College Park, USA) , Chung-Shing Lee (Pacific Lutheran University, Tacoma, Washington, USA) , Wang Yong Wen (China Integrated Circuit Design, Beijing, China) , Zong Xiang Fu (China Integrated Circuit Design, Beijing, China)Publisher: Taylor & Francis Inc Imprint: CRC Press Inc Dimensions: Width: 15.60cm , Height: 1.10cm , Length: 23.40cm Weight: 0.360kg ISBN: 9780849331749ISBN 10: 0849331749 Pages: 192 Publication Date: 20 May 1999 Audience: College/higher education , Professional and scholarly , Undergraduate , Postgraduate, Research & Scholarly Format: Paperback Publisher's Status: Active Availability: In Print ![]() This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsReviewsAuthor InformationMichael Pecht, Chung-Shing Lee, Wang Yong Wen, Zong Xiang Fu, Jiang Jun Lu Tab Content 6Author Website:Countries AvailableAll regions |