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OverviewFull Product DetailsAuthor: Michael Pecht (University of Maryland, College Park, USA) , Chung-Shing Lee (Pacific Lutheran University, Tacoma, Washington, USA) , Wang Yong Wen (China Integrated Circuit Design, Beijing, China) , Zong Xiang Fu (China Integrated Circuit Design, Beijing, China)Publisher: Taylor & Francis Ltd Imprint: CRC Press Weight: 0.453kg ISBN: 9781138434646ISBN 10: 1138434647 Pages: 192 Publication Date: 03 November 2017 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsReviewsAuthor InformationMichael Pecht, Chung-Shing Lee, Wang Yong Wen, Zong Xiang Fu, Jiang Jun Lu Tab Content 6Author Website:Countries AvailableAll regions |
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