Accelerated Stress Testing Handbook: Guide for Achieving Quality Products

Author:   H. Anthony Chan (Lucent Technologies, Inc.)
Publisher:   John Wiley & Sons Inc
ISBN:  

9780780360259


Pages:   372
Publication Date:   01 January 2001
Format:   Hardback
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Accelerated Stress Testing Handbook: Guide for Achieving Quality Products


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Overview

"As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's ""toolbox"" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST). The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame. Important topics covered include: Theoretical basis for AST General AST best practices AST design and manufacturing processes AST equipment and techniques AST process safety qualification In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs."

Full Product Details

Author:   H. Anthony Chan (Lucent Technologies, Inc.)
Publisher:   John Wiley & Sons Inc
Imprint:   Wiley-IEEE Press
Dimensions:   Width: 17.90cm , Height: 2.60cm , Length: 26.90cm
Weight:   0.821kg
ISBN:  

9780780360259


ISBN 10:   0780360257
Pages:   372
Publication Date:   01 January 2001
Audience:   College/higher education ,  Professional and scholarly ,  Undergraduate ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Reviews

This is a most thorough and up--to--date handbook...I highly recommend it to all readers in this field of interest... (IEEE Instrumentation and Measurement Magazine, December 2001)


Author Information

About the Editors H. Anthony Chan has been with AT&T Labs and the former AT&T Bell Labs for 14 years, specializing in product development and manufacturing, including interconnection technology, manufacture assembly and reliability, network management, and wireless network. He has been responsible for R&D in robust product design and manufacture and for guiding various manufacturing locations in planning and conducting reliability and stress testing programs. Dr. Chan has taught several training courses in reliability and stress testing and is a regular speaker on these topics. Moreover, he is an adjunct faculty member at the Hong Kong Polytechnic University. Paul J. Englert is a distinguished member of the technical staff in the Product Realization Department of Lucent Technologies' Wireless Networks Group. He is responsible for wide-scale deployment of mechanical computer-aided design (CAD) and work-in-progress data management solutions. Also, Dr. Englert develops Web-based, multimedia training tools for engineering practices and CAD tools and has lectured in China, Singapore, South Korea, and Taiwan on these subjects. Also, his experience spans a broad spectrum of projects in assembly, manufacturing, stress testing, chemical solvent replacement process development, and statistical modeling.

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