Overview
The conference was on reliability related science in ULSI interconnect. Its main purpose was to discuss the stress induced phenomena in the LSI interconnect among academic researchers and industry engineers to establish academic science and to improve the reliability of ULSI chips. All papers were peer reviewed.
Full Product Details
Author: Shinichi Ogawa ,
Paul S. Ho ,
Ehrenfried Zschech
Publisher: American Institute of Physics
Imprint: American Institute of Physics
Volume: v. 945
Dimensions:
Width: 16.20cm
, Height: 1.60cm
, Length: 23.40cm
Weight: 0.458kg
ISBN: 9780735404595
ISBN 10: 0735404593
Pages: 212
Publication Date: 13 November 2007
Audience:
Professional and scholarly
,
Professional & Vocational
Format: Hardback
Publisher's Status: Active
Availability: In Print
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Reviews
From the reviews: An impressive work of research and collaborative presentation of papers on current research and thinking on issues related to stress-induced phenomena in metallization. There is much to admire here. ... It is with great pleasure that materials and reliability researchers, and process engineers related to LSI interconnect fabrication, will turn to this latest volume. ... All the papers are well supported by references and illustrations with plenty of tables, graphs half tones and line drawings all neatly executed. (Current Engineering Practice, 2008)
From the reviews: <p> An impressive work of research and collaborative presentation of papers on current research and thinking on issues related to stress-induced phenomena in metallization. There is much to admire here. a ] It is with great pleasure that materials and reliability researchers, and process engineers related to LSI interconnect fabrication, will turn to this latest volume. a ] All the papers are well supported by references and illustrations with plenty of tables, graphs half tones and line drawings all neatly executed. (Current Engineering Practice, 2008)
From the reviews: An impressive work of research and collaborative presentation of papers on current research and thinking on issues related to stress-induced phenomena in metallization. There is much to admire here. ! It is with great pleasure that materials and reliability researchers, and process engineers related to LSI interconnect fabrication, will turn to this latest volume. ! All the papers are well supported by references and illustrations with plenty of tables, graphs half tones and line drawings all neatly executed. (Current Engineering Practice, 2008)
