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OverviewThese proceedings present current research on issues related to stress-induced phenomena in on-chip metal interconnects and solder joints. This volume will appeal to scientists, engineers, graduate students interested in research and development of microelectronic devices as well as technology integration, and semiconductor industry professionals and equipment suppliers. Full Product DetailsAuthor: Ehrenfried Zschech , Karen Maex , P. S. Ho , Hisao KawasakiPublisher: American Institute of Physics Imprint: American Institute of Physics Edition: 2006 ed. Volume: v. 817 Dimensions: Width: 15.50cm , Height: 2.50cm , Length: 23.50cm Weight: 0.742kg ISBN: 9780735403109ISBN 10: 0735403104 Pages: 383 Publication Date: 01 February 2006 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Out of stock The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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