Stochastic Finite Element Modeling in Electronic Packaging
Author:   Liu Chu (ShanghaiTech University, China)
Publisher:   John Wiley & Sons Inc
ISBN:  

9781394352944


Pages:   304
Publication Date:   22 February 2026
Format:   Hardback
Availability:   Awaiting stock   Availability explained


Our Price $182.95 Quantity:  
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Stochastic Finite Element Modeling in Electronic Packaging


Overview

Full Product Details

Author:   Liu Chu (ShanghaiTech University, China)
Publisher:   John Wiley & Sons Inc
Imprint:   Wiley-IEEE Press
ISBN:  

9781394352944


ISBN 10:   1394352948
Pages:   304
Publication Date:   22 February 2026
Audience:   Professional and scholarly ,  College/higher education ,  Professional & Vocational ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Forthcoming
Availability:   Awaiting stock   Availability explained

Table of Contents

Chapter 1. Overview Chapter 2. Electronic packaging Chapter 3. Random Sampling Methods Chapter 4. Random Fields and Stochastic Processes Chapter 5. Reliability Prediction Chapter 6. Finite element method Chapter 7. Nonlinear Stochastic finite element method Chapter 8. Random shear stress and thermal temperature Chapter 9. Material uncertainty in electro-migration Chapter 10. Mechanical reliability in the replaceable integrated chiplet assembly Chapter 11. Kriging Surrogate Model Chapter 12. Digital twins based on SFEM

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Author Information

Liu Chu, PhD, is a Senior Researcher in the School of Physical Science and Technology at ShanghaiTech University. Her research is primarily focused on uncertainty quantification in stochastic defects, numerical simulations for electronic packaging, and the development of advanced computational mechanics methods.

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