Solutions Manual to accompany Engineering Materials Science
Author:   Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired))
Publisher:   Elsevier Science Publishing Co Inc
ISBN:  

9780125249980


Pages:   160
Publication Date:   13 January 2000
Format:   Paperback
Availability:   In Print   Availability explained
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

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Solutions Manual to accompany Engineering Materials Science


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Author:   Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired))
Publisher:   Elsevier Science Publishing Co Inc
Imprint:   Academic Press Inc
Dimensions:   Width: 15.20cm , Height: 0.90cm , Length: 22.90cm
Weight:   0.390kg
ISBN:  

9780125249980


ISBN 10:   0125249985
Pages:   160
Publication Date:   13 January 2000
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Out of Print
Availability:   In Print   Availability explained
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

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Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.

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