Solder Joint Technology: Materials, Properties, and Reliability
Author:   King-Ning Tu
Publisher:   Springer-Verlag New York Inc.
Edition:   2007 ed.
Volume:   92
ISBN:  

9780387388908


Pages:   370
Publication Date:   22 August 2007
Format:   Hardback
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Our Price $472.56 Quantity:  
Add to Cart

Share |

Solder Joint Technology: Materials, Properties, and Reliability


Overview

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Full Product Details

Author:   King-Ning Tu
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   2007 ed.
Volume:   92
Dimensions:   Width: 15.60cm , Height: 2.30cm , Length: 23.50cm
Weight:   1.590kg
ISBN:  

9780387388908


ISBN 10:   0387388907
Pages:   370
Publication Date:   22 August 2007
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

Copper—Tin Reactions.- Copper–Tin Reactions in Bulk Samples.- Copper–Tin Reactions in Thin-Film Samples.- Copper–Tin Reactions in Flip Chip Solder Joints.- Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops.- Spontaneous Tin Whisker Growth: Mechanism and Prevention.- Solder Reactions on Nickel, Palladium, and Gold.- Electromigration and Thermomigration.- Fundamentals of Electromigration.- Electromigration in Flip Chip Solder Joints.- Polarity Effect of Electromigration on Solder Reactions.- Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration.- Thermomigration.

Reviews

Author Information

Tab Content 6

Author Website:  

Countries Available

All regions
Latest Reading Guide

NOV RG 20252

 

Shopping Cart
Your cart is empty
 Shopping cart
Mailing List

 

Sign up now