Soil Stress-Strain Behavior: Measurement, Modeling and Analysis: A Collection of Papers of the Geotechnical Symposium in Rome, March 16-17, 2006. Solid Mechanics and Its Applications

Author:   Hoe I Ling ,  Luigi Callisto ,  Dov Leshchinsky ,  Junichi Koseki
Publisher:   Springer
ISBN:  

9786611137588


Pages:   992
Publication Date:   01 January 2007
Format:   Electronic book text
Availability:   Out of stock   Availability explained
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Soil Stress-Strain Behavior: Measurement, Modeling and Analysis: A Collection of Papers of the Geotechnical Symposium in Rome, March 16-17, 2006. Solid Mechanics and Its Applications


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This book has grown out of the proceedings of the Geotechnical Symposium in Rome, held in 2006 in the Italian capital. The valuable contributions contained in its pages reflect the importance of the symposium, which was organized to celebrate the 60th birthday of Prof. Tatsuoka as well as honoring his research achievement. The publications are focused on the recent developments in the stress-strain behavior of geomaterials, with an emphasis on laboratory measurements, soil constitutive modeling and behavior of soil structures (such as reinforced soils, piles and slopes). The latest advancements in the field, such as the rate effect and dynamic behavior of both clay and sand, the behavior of modified soils and soil mixtures, and soil liquefaction, are all addressed. A special keynote paper by Prof. Tatsuoka is included along with three other keynote papers (presented by Prof. Lo Presti, Prof. Di Benedetto, and Prof. Shibuya).

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Author:   Hoe I Ling ,  Luigi Callisto ,  Dov Leshchinsky ,  Junichi Koseki
Publisher:   Springer
Imprint:   Springer
ISBN:  

9786611137588


ISBN 10:   6611137580
Pages:   992
Publication Date:   01 January 2007
Audience:   General/trade ,  General
Format:   Electronic book text
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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