|
![]() |
|||
|
||||
OverviewBondgraphs are a powerful tool in the simulation of mechanical, hydraulic, electric and thermal systems. They are used to represent engineering systems in written form by means of letter elements and their interconnections, called bonds, instead of in the form of numerous equations. They may be used to increase the efficiency of new product design. This book introduces the reader to bondgraphs and their use on PCs. A broad variety of applications of this method in the simulation of the above systems is presented. Twenty fully worked examples complement the presentation. Full Product DetailsAuthor: Jean U. ThomaPublisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Imprint: Springer-Verlag Berlin and Heidelberg GmbH & Co. K Weight: 0.435kg ISBN: 9783540516408ISBN 10: 3540516409 Pages: 196 Publication Date: 15 June 1990 Audience: College/higher education , Professional and scholarly , Undergraduate , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: Out of stock ![]() The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |