Signal Propagation on Interconnects

Author:   Hartmut Grabinski ,  Petra Nordholz
Publisher:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 1998
ISBN:  

9781441950598


Pages:   148
Publication Date:   03 December 2010
Format:   Paperback
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Signal Propagation on Interconnects


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Full Product Details

Author:   Hartmut Grabinski ,  Petra Nordholz
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 1998
Dimensions:   Width: 15.50cm , Height: 0.80cm , Length: 23.50cm
Weight:   0.454kg
ISBN:  

9781441950598


ISBN 10:   1441950591
Pages:   148
Publication Date:   03 December 2010
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

Table of Contents

Foreword; J.P. Mucha. Editors' Introduction; P. Nordholz, H. Grabinsky. Analysis of Frequency-Dependent Transmission Lines Using Rational Approximation and Recursive Convolution; W.T. Beyenne, J.E. Schutt-Ainé. Accurate Modeling of Interconnections for Timing Simulation of Sub-Micron Circuits; D. Deschacht, E. Vanier. Minimum Realization of Reduced-Order High-Speed Interconnect Macromodels; R. Achar, M. Nakhla. Lossy Interconnect Modeling for Transient Simulations; I. Maio, F. Canavero. Algorithms Supporting Driver/Receiver Design for Multi-Conductor Interconnects; O.A. Palusinski, et al. Prediction of PCB Susceptibility to Conducted Noise at Post Layout Level; D. Lasagna, et al. Experimental Validation of a Hybrid Method that Predicts Emissions Radiated by Printed Circuit Boards; E. Leroux, et al. Hybrid Time/Frequency-Domain Simulation of Transient Electromagnetic Coupling of Interconnects; A. Dietermann, et al. Simulation of Electromagnetic Wave Propagation on a Printed Circuit Board with Linear and Nonlinear Discrete Loads; M. Witting, T. Proepper. A Model for Ground Bounce Investigation in Structures with Conducting Planes; O. Kosch, et al. Influence of a Floating Plane on an Effective Ground Plane Inductance in Multilayer Packages; M. Lopez, et al. Analysis and Measurement of Crosstalk Induced Delay Errors in Integrated Circuits; F. Moll, et al.

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