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OverviewSignal Integrity Characterization Techniques addresses the gap between traditional digital and microwave curricula all while focusing on a practical and intuitive understanding of signal integrity effects within the data transmission channel. High-speed interconnects such as connectors, PCBs, cables, IC packages, and backplanes are critical elements of differential channels that must be designed using today's most powerful analysis and characterization tools.Both measurements and simulation must be done on the device under test, and both activities must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements - from backplane for design challenges to error correction techniques to jitter measurement technologies. The authors' approach wisely addresses some of these new high-speed technologies, and it also provides valuable insight into its future direction and will teach the reader valuable lessons on the industry. Full Product DetailsAuthor: Eric Bogatin , Mike RessoPublisher: International Engineering Consortium Imprint: International Engineering Consortium Dimensions: Width: 15.50cm , Height: 4.10cm , Length: 22.90cm Weight: 1.043kg ISBN: 9781931695930ISBN 10: 1931695938 Pages: 375 Publication Date: 15 February 2009 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Out of Print Availability: In Print ![]() Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |