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OverviewFull Product DetailsAuthor: Q.-Y. Tong (Duke University, Durham, North Carolina, Max-Planck-Institute of Microstructure Physics, Halle, Germany, Southeast University, Nanjing, China) , U. Gösele (Max-Planck-Institute of Microstructure Physics, Halle, Germany, Duke University, Durham, North Carolina)Publisher: John Wiley & Sons Inc Imprint: Wiley-Interscience Dimensions: Width: 16.40cm , Height: 2.00cm , Length: 24.60cm Weight: 0.517kg ISBN: 9780471574811ISBN 10: 0471574813 Pages: 320 Publication Date: 18 December 1998 Audience: College/higher education , Professional and scholarly , Undergraduate , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: Out of stock ![]() The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsReviewsAuthor InformationQ.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University's School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Triangle Institute. He was formerly a consultant at the Max-Planck-Institute of Microstructure Physics. U. GÖSELE, PhD, is Director at the Max-Planck-Institute of Microstructure Physics in Halle, Germany, and J.B. Duke Professor of Materials Science at Duke University's School of Engineering in Durham, North Carolina. Tab Content 6Author Website:Countries AvailableAll regions |