SemiConductor Wafer Bonding: Science and Technology

Author:   Q.-Y. Tong (Duke University, Durham, North Carolina, Max-Planck-Institute of Microstructure Physics, Halle, Germany, Southeast University, Nanjing, China) ,  U. Gösele (Max-Planck-Institute of Microstructure Physics, Halle, Germany, Duke University, Durham, North Carolina)
Publisher:   John Wiley & Sons Inc
ISBN:  

9780471574811


Pages:   320
Publication Date:   18 December 1998
Format:   Hardback
Availability:   Out of stock   Availability explained
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SemiConductor Wafer Bonding: Science and Technology


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Author:   Q.-Y. Tong (Duke University, Durham, North Carolina, Max-Planck-Institute of Microstructure Physics, Halle, Germany, Southeast University, Nanjing, China) ,  U. Gösele (Max-Planck-Institute of Microstructure Physics, Halle, Germany, Duke University, Durham, North Carolina)
Publisher:   John Wiley & Sons Inc
Imprint:   Wiley-Interscience
Dimensions:   Width: 16.40cm , Height: 2.00cm , Length: 24.60cm
Weight:   0.517kg
ISBN:  

9780471574811


ISBN 10:   0471574813
Pages:   320
Publication Date:   18 December 1998
Audience:   College/higher education ,  Professional and scholarly ,  Undergraduate ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Q.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University's School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Triangle Institute. He was formerly a consultant at the Max-Planck-Institute of Microstructure Physics. U. GÖSELE, PhD, is Director at the Max-Planck-Institute of Microstructure Physics in Halle, Germany, and J.B. Duke Professor of Materials Science at Duke University's School of Engineering in Durham, North Carolina.

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