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OverviewFull Product DetailsAuthor: S. A. Campbell , H. J. LewerenzPublisher: John Wiley and Sons Ltd Imprint: John Wiley & Sons Ltd Edition: Volume 2 Dimensions: Width: 16.40cm , Height: 5.20cm , Length: 24.10cm Weight: 1.358kg ISBN: 9780471966821ISBN 10: 0471966827 Pages: 408 Publication Date: 26 March 1998 Audience: College/higher education , Professional and scholarly , Postgraduate, Research & Scholarly , Professional & Vocational Format: Hardback Publisher's Status: Out of Print Availability: In Print ![]() Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock. Table of ContentsVolume 2 Anisotrophy and the Micromachining of Silicon A. Campbell, et al. Etch Stops S. Collins Photonic Integrated Circuits, Technology and Concepts R. Matz Monolithically Integrated Sensors for Mechanical Quantities in Standard CMOS Processing H. Offereins, et al. Silicon on Insulators C. Harendt and G. Roos Integrated Sensors and Actuators N. Najaft Smart Sensors N. Najaft and J. Moyne Anodic Oxidation of Silicon as a Low-Temperature Passivation Technique G. Mende Micromachined Optoelectronic Structures and Devices P. Deimel Wet and Dry Etching: A Comparison in the Context of Solid State Electronics Applications K. Bachmann IndexReviewsAuthor InformationS. A. Campbell is the editor of Semiconductor Micromachining, Volume 2, Techniques and Industrial Applications, published by Wiley. H. J. Lewerenz is the editor of Semiconductor Micromachining, Volume 2, Techniques and Industrial Applications, published by Wiley. Tab Content 6Author Website:Countries AvailableAll regions |