Overview

Robotic Cell Manipulation introduces up-to-date research to realize this new theme of medical robotics. The book is organized in three levels: operation tools (e.g., optical tweezers, microneedles, dielectrophoresis, electromagnetic devices, and microfluidic chips), manipulation types (e.g., microinjection, transportation, rotation fusion, adhesion, separation, etc.), and potential medical applications (e.g., micro-surgery, biopsy, gene editing, cancer treatment, cell-cell interactions, etc.). The technology involves different fields such as robotics, automation, imaging, microfluidics, mechanics, materials, biology and medical sciences. The book provides systematic knowledge on the subject, covering a wide range of basic concepts, theories, methodology, experiments, case studies and potential medical applications. It will enable readers to promptly conduct a systematic review of research and become an essential reference for many new and experienced researchers entering this unique field.

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9780323852593

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Dong Sun is currently a Chair Professor and Head of the Department of Biomedical Engineering, and also Director of the Centre of Robotics and Automation, City University of Hong Kong. He is among the leading contributors worldwide in pioneering work in robotic manipulation of biological cells. His research has breakthrough in the use of combined robotics and various micro-engineering tools including optical tweezers, micro-needles and electromagnetic devices to achieve cell manipulation, diagnosis and micro-surgery at the single cell level. He led the invention of the magnetically driven microrobots that deliver cells to precise locations in the body. Over the past 20 years, he has co-authored 17 books and book chapters, 420 journal and conference papers with h-Index of over 50, and holds 13 international patents. He has received a lot of awards including best paper awards, Natural Science Award from China, and Hong Kong Awards for Industry. He is a fellow of Canadian Academy of Engineering and a fellow of IEEE.

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