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OverviewFull Product DetailsAuthor: Mike Golio (HVVi Semiconductors, Inc., Phoenix, Arizona, USA) , Mike Golio (HVVi Semiconductors, Inc., Phoenix, Arizona, USA) , Lawrence P. Dunleavy , Jack East (University of Michigan, Ann Arbor, Michigan, USA)Publisher: Taylor & Francis Inc Imprint: CRC Press Inc Dimensions: Width: 17.80cm , Height: 2.40cm , Length: 25.40cm Weight: 0.780kg ISBN: 9780849315626ISBN 10: 084931562 Pages: 332 Publication Date: 28 October 2002 Audience: College/higher education , Professional and scholarly , Undergraduate , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: In Print This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsReviews"""Overall this is an excellent book and a useful complement to older standard texts. Those readers searching for a book on modern RF semiconductor devices, modeling, and thermal analysis will be very happy."" -Alfy Riddle ""A team of 20 authors drawn from industry and academia, under the leadership of Golio of Motorola, has composed this 17-chapter, 310-page handbook…Layout, typography, and particularly the diagrams are exceptionally good. For practicing engineers in industry, government, and academia."" -G. Weiss, emeritus, Polytechnic University" Overall this is an excellent book and a useful complement to older standard texts. Those readers searching for a book on modern RF semiconductor devices, modeling, and thermal analysis will be very happy. -Alfy Riddle A team of 20 authors drawn from industry and academia, under the leadership of Golio of Motorola, has composed this 17-chapter, 310-page handbook...Layout, typography, and particularly the diagrams are exceptionally good. For practicing engineers in industry, government, and academia. -G. Weiss, emeritus, Polytechnic University Overall this is an excellent book and a useful complement to older standard texts. Those readers searching for a book on modern RF semiconductor devices, modeling, and thermal analysis will be very happy. -Alfy Riddle A team of 20 authors drawn from industry and academia, under the leadership of Golio of Motorola, has composed this 17-chapter, 310-page handbookLayout, typography, and particularly the diagrams are exceptionally good. For practicing engineers in industry, government, and academia. -G. Weiss, emeritus, Polytechnic University Author InformationMike Golio Tab Content 6Author Website:Countries AvailableAll regions |
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