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OverviewRF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Full Product DetailsAuthor: Ken Kuang , Franklin Kim , Sean S. CahillPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 2010 ed. Dimensions: Width: 15.50cm , Height: 1.70cm , Length: 23.50cm Weight: 1.330kg ISBN: 9781441909831ISBN 10: 1441909834 Pages: 285 Publication Date: 17 November 2009 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print ![]() This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |