Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics

Author:   Marco Rossi ,  Marco Sasso ,  Nathanael Connesson ,  Raman Singh
Publisher:   Springer International Publishing AG
Edition:   Softcover reprint of the original 1st ed. 2014
ISBN:  

9783319376493


Pages:   377
Publication Date:   23 August 2016
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics


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Author:   Marco Rossi ,  Marco Sasso ,  Nathanael Connesson ,  Raman Singh
Publisher:   Springer International Publishing AG
Imprint:   Springer International Publishing AG
Edition:   Softcover reprint of the original 1st ed. 2014
Weight:   9.412kg
ISBN:  

9783319376493


ISBN 10:   3319376497
Pages:   377
Publication Date:   23 August 2016
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

From the Contents: Analysis of Thrust Production in Small Synthetic Flapping Wings.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian  CT Reconstruction.  Part I: Discretization and Algorithm.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian  CT Reconstruction.  Part II: Hardware Design and Demonstration.- Crack Nucleation Threshold Under Fretting Loading by a Thermal Method.- Crack Growth Study of Fibre Metal Laminates Using Thermoelastic Stress Analysis.- Crack Detection in Large Welded Components Under Fatigue Using TSA.- Hybrid Thermoelastic Analysis of an Unsymmetrically-loaded Structure containing an Arbitrarily-shaped Cutout.- Quantitative Themographic Characterization of Composites.- Thermal Deformation of Micro-structure Diffuser Plate in LED Backlight Unit.- Polariscopy Measurement of Residual Stress in Thin Silicon Wafers.

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