Overview

This text explains reliability issues in microelectronics systems manufacturing and software development with an emphasis on evolving manufacturing technology for the semiconductor industry. Since most microelectronics components have an infant mortality period of about one year under ordinary operating conditions, and many modern systems, such as PCs, are heavily used in the first few years, the reliability problem in the infant mortality period becomes extremely important. Burn-in is an accelerated screening procedure that eliminates infant mortalities early on in the shop before shipping out the products to the customers. This book should also help readers to analyze systems that exhibit high failure rate during a long infant mortality period. The text presents ways to systematically analyze burn-in policy at the component, sub-system, and system levels. Various statistical methods are addressed including parametric, nonparametric, and Bayesian approaches. Many case studies are introduced in combination with the developed theories. Included in the book is an introduction to software reliability. The book should help manufacturers and system designers to understand and to design a more reliable product given constraints specified by the users and designers. An understanding of the infant mortality period may solve many reliability problems, including those faced in the semiconductor industry and software industry.

Full Product Details

Author:   Way Kuo ,  Wei-Ting Kary Chien ,  Taeho Kim
Publisher:   Springer
Imprint:   Springer
Edition:   1998 ed.
Dimensions:   Width: 15.50cm , Height: 2.30cm , Length: 23.50cm
Weight:   1.710kg
ISBN:  

9780792381075

ISBN 10:   0792381076
Pages:   394
Publication Date:   31 January 1998
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

1 Overview of Design, Manufacture, and Reliability.- 1.1 Production and Manufacturing Issues.- 1.2 Taguchi Method in Quality Engineering.- 1.3 Manufacturing Design and Reliability.- 1.4 Reliability Standards.- 1.5 Conclusions.- 2 Integrating Reliability into Microelectronics Manufacturing.- 2.1 Microelectronics Manufacturing.- 2.2 New Techniques for Reliability Improvement.- 2.3 Manufacturing Yield and Reliability.- 2.4 Conclusions.- 3 Basic Reliability Concept.- 3.1 Elements of Reliability.- 3.2 Some Useful Life Distributions.- 3.3 Strength and Stress Analysis.- 3.4 Multicomponents Systems.- 3.5 Conclusions.- 4 Yield and Modeling Yield.- 4.1 Definitions and Concept.- 4.2 Yield Models.- 4.3 Yield Prediction.- 4.4 Yield Estimation.- 4.5 Fault Coverage and Occurrence.- 4.6 Yield-reliability Relation Model.- 4.7 Cost Model.- 4.8 Conclusions.- 5 Reliability Stress Tests.- 5.1 Accelerated Life Tests.- 5.2 Environmental Stress Screening (ESS).- 5.3 Failures and Reliability Prediction.- 5.4 Conclusions.- 6 Burn-in Performance, Cost, and Statistical Analysis.- 6.1 Design of Burn-in.- 6.2 Performance and Cost Modeling.- 6.3 Burn-in Optimization.- 6.4 Statistical Approaches for Burn-in Analysis.- 6.5 Conclusions.- 7 Nonparametric Reliability Analysis.- 7.1 The Proportional Hazard Rate Model.- 7.2 The Life Table Estimator (LTE).- 7.3 The Kaplan-Meier Product Limits Estimator.- 7.4 Goodness-of-fit (GOF) Tests.- 7.5 Smoothing Techniques.- 7.6 Conclusions.- 8 Parametric Approaches To Decide Optimal System Burn-in Time.- 8.1 A Time-independent Model.- 8.2 A Time-dependent Model.- 8.3 Conclusions.- 9 Nonparametric Approach and Its Applications to Burn-in.- 9.1 Introduction.- 9.2 Methods.- 9.3 Applications.- 9.4 Conclusions.- 10 Nonparametric Bayesian Approach for Optimal Burn-in.- 10.1The Dirichlet Distribution.- 10.2 The Model Formulation.- 10.3 Other Considerations.- 10.4 Conclusions.- 11 The Dirichlet Process for Reliability Analysis.- 11.1 Method.- 11.2 Variance Reduction in the Dirichlet Process.- 11.3 Determining Optimal Burn-in Time Using the Dirichlet Process.- 11.4 Conclusions.- 12 Software Reliability and Infant Mortality Period of the Bathtub Curve.- 12.1 Basic Concept and Definitions.- 12.2 Stochastic Software Reliability Models.- 12.3 The Non-stochastic Software Reliability Models.- 12.4 A Proposed Procedure of Testing Data.- 12.5 Software Reliability Management.- 12.6 Conclusions.- Epilogue: Cost-effective Design for Stress Burn-in.- References.- Appendices.- A Notation and Nomenclature.- B Failure Modes for Parts.- C Common Probability Distributions.- C.1 Discrete Distributions.- C.2 Continuous Distributions.- D Simulation for U-shaped Hazard Rate Curves.- D.1 Generating U-shaped Hazard Rate Curves.- D.2 Simulation.- E Sample Programs.- E.1 A Sample GINO Program.- E.2 A Sample GAMS program.

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