Reliability Technology for Integrated Circuit Packaging
Author:   Bin Zhou ,  Yunfei En ,  Si Chen
Publisher:   Springer Verlag, Singapore
ISBN:  

9789819538843


Pages:   510
Publication Date:   14 April 2026
Format:   Hardback
Availability:   Not yet available   Availability explained
This item is yet to be released. You can pre-order this item and we will dispatch it to you upon its release.

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Reliability Technology for Integrated Circuit Packaging


Overview

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress. Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of ""high-quality development"" a focus on reliability is essential to advancing manufacturing. Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

Full Product Details

Author:   Bin Zhou ,  Yunfei En ,  Si Chen
Publisher:   Springer Verlag, Singapore
Imprint:   Springer Verlag, Singapore
ISBN:  

9789819538843


ISBN 10:   981953884
Pages:   510
Publication Date:   14 April 2026
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Forthcoming
Availability:   Not yet available   Availability explained
This item is yet to be released. You can pre-order this item and we will dispatch it to you upon its release.

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