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Author:   J. W. McPherson
Publisher:   Springer International Publishing AG
Imprint:   Springer International Publishing AG
Edition:   2nd ed. 2013
Dimensions:   Width: 15.50cm , Height: 2.20cm , Length: 23.50cm
Weight:   6.263kg
ISBN:  

9783319033297

ISBN 10:   3319033298
Pages:   399
Publication Date:   09 July 2015
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand  
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Table of Contents

Introduction.- Materials and Device Degradation.- From Material/Device Degradation to Time-To-Failure.- Time-To-Failure Modeling.- Gaussian Statistics – An Overview.- Time-To-Failure Statistics.- Failure Rate Modeling.- Accelerated Degradation.- Acceleration Factor Modeling.- Ramp-To-Failure Testing.- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits Breakdown (TDDB).- Time-To-Failure Models for Selected Failure Mechanisms In Mechanical Engineering.- Conversion of Dynamical Stresses Into Effective Static Values.- Increasing the Reliability of Device/Product Designs.- Screening.- Heat Generation and Dissipation.- Sampling Plans and Confidence Intervals.- Appendix A: Useful Conversion Factors.- Appendix B: Useful Physical Constants.- Appendix C: Useful Rough Rules-Of-Thumb.- Appendix D: Useful Mathematical Expressions.- Appendix E: Useful Differentials and Definite Integrals.- Appendix F: Free-Energy.- Appendix G: t(1-α/2,ν) Distribution Values.- Appendix H: χ2(P,ν) Distribution Values.- Index.

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Dr. J.W. McPherson is at McPherson Reliability Consulting, LLC.

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