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OverviewReliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter. Full Product DetailsAuthor: Johan Liu , Olli Salmela , Jussi Sarkka , James E. MorrisPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 2011 ed. Dimensions: Width: 15.50cm , Height: 1.40cm , Length: 23.50cm Weight: 1.080kg ISBN: 9781441957597ISBN 10: 1441957596 Pages: 204 Publication Date: 14 February 2011 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print ![]() This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsIntroduction to Reliability and its Importance.- Reliability Metrology.- General Failure Mechanisms of Microsystems.- Solder and Conductive Adhesive Joint Reliability.- Accelerated Testing.- Reliability Design for Manufacturability.- Component Reliability.- System Level Reliability.- Reliability and Quality Management of Microsystem.- Experimental Tools for Reliability Analysis.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |