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OverviewRapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field. Full Product DetailsAuthor: Victor E. Borisenko , Peter J. HeskethPublisher: Springer Science+Business Media Imprint: Plenum Publishing Co.,N.Y. Edition: 1997 ed. Dimensions: Width: 17.80cm , Height: 2.60cm , Length: 25.40cm Weight: 2.090kg ISBN: 9780306450549ISBN 10: 0306450542 Pages: 358 Publication Date: 31 May 1997 Audience: College/higher education , Professional and scholarly , Undergraduate , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: In Print This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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