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OverviewThis special report with user-friendly software has been produces following a collaboration between the Centre for Adhesives technology at TWI, Cranfield University and the DTI. The three-year project identified that highlighting design and production issue during very early stages of design enabled potential problem areas to be recognised and avoided. The team have therefore developed a generic quality assurance model to pinpoint the issues needing to be addressed well before a component reaches the production stage.The software is extremely user-friendly and comes with a flexible menu selection which enables the model to be customised to particular manufacturing requirements. It will be widely welcomed by designers and engineers involved with any products using adhesives or sealants. Full Product DetailsAuthor: A.W. Espie (TWI) , J. H. Rogerson , K. Ebtehaj (Cranfield University, UK)Publisher: Elsevier Science & Technology Imprint: Woodhead Publishing Ltd Dimensions: Width: 21.00cm , Height: 1.50cm , Length: 29.70cm Weight: 0.600kg ISBN: 9781855732599ISBN 10: 1855732599 Pages: 176 Publication Date: 01 January 1998 Audience: Professional and scholarly , General/trade , Professional & Vocational , General Format: Paperback Publisher's Status: Unknown Availability: Out of stock Table of ContentsIntroduction to quasiat; Quality management; Quality management applied to adhesive technology; Quality management model, PC based; Some examples of the use of quality tools and techniques applied to adhesive technology.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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