Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition

Author:   Ali Jamnia
Publisher:   Taylor & Francis Ltd
Edition:   3rd edition
ISBN:  

9781032097824


Pages:   374
Publication Date:   30 June 2021
Format:   Paperback
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition


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Full Product Details

Author:   Ali Jamnia
Publisher:   Taylor & Francis Ltd
Imprint:   CRC Press
Edition:   3rd edition
Weight:   0.530kg
ISBN:  

9781032097824


ISBN 10:   1032097825
Pages:   374
Publication Date:   30 June 2021
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

Introduction. Basic Heat Transfer—Conduction, Convection, and Radiation. Conductive Cooling. Radiation Cooling. Fundamentals of Convection Cooling. Combined Modes, Transient Heat Transfer, and Advanced Materials. Basics of Vibration and Its Isolation. Basics of Shock Management. Induced Stresses. The Finite Element Methods. Mechanical and Thermomechanical Concerns. Acoustics. Mechanical Failures and Reliability. Electrical Failures and Reliability. Chemical Attack Failures and Reliability Concerns. Reliability Models, Predictions, and Calculations. Design Considerations in an Avionics Electronic Package. Appendices. References.

Reviews

This book is intended for a hands-on engineer who needs back-of-the-envelope tools to develop design parameters and develop a means to conduct sanity checks. The true value of the book, however, is to raise the awareness of the design team on various aspects of the design that leads to developing a more reliable product. -James Feine, President, USI Ultrasonic, Houston, Texas, USA


Author Information

Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations. Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning StationTM - used as a teaching tool for individuals with cognitive disabilities.

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