Overview

The First Comprehensive, Example-Rich Guide to Power Integrity ModelingProfessionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Full Product Details

Author:   Madhavan Swaminathan ,  Ege Engin
Publisher:   Pearson Education (US)
Imprint:   Prentice Hall
Dimensions:   Width: 18.00cm , Height: 3.00cm , Length: 24.30cm
Weight:   0.920kg
ISBN:  

9780136152064

ISBN 10:   0136152066
Pages:   496
Publication Date:   18 December 2007
Audience:   College/higher education ,  Tertiary & Higher Education
Format:   Hardback
Publisher's Status:   Out of Print
Availability:   Awaiting stock  

Table of Contents

Preface        xiii Acknowledgments        xvii About the Authors        xxiChapter 1: Basic Concepts        11.1    Introduction        1 1.2    Simple Relationships for Power Delivery        10 1.3    Design of PDNs        17 1.4    Components of a PDN        24 1.5    Analysis of PDNs        45 1.6    Chip-Package Antiresonance: An Example        61 1.7    High-Frequency Measurements        65 1.8    Signal Lines Referenced to Planes        71 1.9    PDN Modeling Methodology        77 1.10  Summary        79 Chapter 2: Modeling of Planes        832.1    Introduction        83 2.2    Behavior of Planes        84 2.3    Lumped Modeling Using Partial Inductances        89 2.4    Distributed Circuit-Based Approaches        94 2.5    Discretization-Based Plane Models        117 2.6    Analytical Methods        133 2.7    Multiple Plane Pairs        138 2.8    Summary        169 Chapter 3: Simultaneous Switching Noise        1753.1    Introduction        175 3.2    Simple Models        177 3.3    Modeling of Transmission Lines and Planes        185 3.4    Application of Models in Time-Domain Analysis        209 3.5    Application of Models in Frequency-Domain Analysis        226 3.6    Extension of M-FDM to Incorporate Transmission Lines        233 3.7    Summary        239 Chapter 4: Time-Domain Simulation Methods        2434.1    Introduction        243 4.2    Rational Function Method        244 4.3    Signal Flow Graphs        295 4.4    Modified Nodal Analysis (MNA)        317 4.5    Summary 327 Chapter 5: Applications 3335.1    Introduction        333 5.2    High-Speed Servers        334 5.3    High-Speed Differential Signaling        349 5.4    Analysis of IC Packages        365 5.5    Extraction of Dielectric Constant and Loss Tangent        372 5.6    Embedded Decoupling Capacitors        392 5.7    Electromagnetic Bandgap (EBG) Structures        415 5.8    Future Challenges        443 Appendix A        451A.1    Multiport Networks        451 A.2    Matrix Representation of Transmission Lines        453 A.3    Spectrum of Digital Signals        454 Appendix B: Software List        459Index        461

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Author Information

Madhavan Swaminathan received his B.E. in electronics and communication from Regional Engineering College, Tiruchirapalli, in 1985, and his M.S. and Ph.D. in electrical engineering from Syracuse University in 1989 and 1991. He is currently the Joseph M. Pettit Professor in Electronics in the School of Electrical and Computer Engineering and deputy director of the Packaging Research Center, Georgia Tech. He is also the cofounder of Jacket Micro Devices, a company specializing in RF modules for wireless applications. Before joining Georgia Tech, he worked on packaging for supercomputers for IBM. Swaminathan has written more than 300 publications, holds 15 patents, and has been honored as an IEEE Fellow for his work on power delivery. A. Ege Engin received his B.S. and M.S. in electrical engineering from Middle East Technical University, Ankara, Turkey, and from the University of Paderborn, Germany. From 2001 to 2004, he was with the Fraunhofer Institute for Reliability and Microintegration in Berlin. During this time, he also received his Ph.D. from the University of Hannover, Germany. He is currently a research engineer in the School of Electrical and Computer Engineering and an assistant research director of the Packaging Research Center at Georgia Tech. He has more than 50 publications in refereed journals and conferences in the areas of signal and power integrity modeling and simulation.

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