Power Electronics Packaging Reliability

Author:   Mark Johnson (University of Nottingham, UK)
Publisher:   Institution of Engineering and Technology
ISBN:  

9781785612527


Pages:   400
Publication Date:   01 June 2020
Format:   Hardback
Availability:   Not yet available   Availability explained
This item is yet to be released. You can pre-order this item and we will dispatch it to you upon its release.

Our Price $422.40 Quantity:  
Pre-Order

Share |

Power Electronics Packaging Reliability


Add your own review!

Overview

Unpredictable fluctuating loads and exposure to widely varying environmental conditions (including heat, vibration, humidity and dust) present a particularly challenging environment for power electronics modules. This book describes the technologies involved in power electronic device manufacturing with an emphasis on characterising the key wear-out mechanisms and technologies to increase reliability. This book is a must-read for all engineers involved with electronics or reliable power systems.

Full Product Details

Author:   Mark Johnson (University of Nottingham, UK)
Publisher:   Institution of Engineering and Technology
Imprint:   Institution of Engineering and Technology
ISBN:  

9781785612527


ISBN 10:   1785612522
Pages:   400
Publication Date:   01 June 2020
Audience:   College/higher education ,  Professional and scholarly ,  Tertiary & Higher Education ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Forthcoming
Availability:   Not yet available   Availability explained
This item is yet to be released. You can pre-order this item and we will dispatch it to you upon its release.

Table of Contents

Reviews

Author Information

Tab Content 6

Author Website:  

Customer Reviews

Recent Reviews

No review item found!

Add your own review!

Countries Available

All regions
Latest Reading Guide

wl

Shopping Cart
Your cart is empty
Shopping cart
Mailing List