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Author:   M. Goosey
Publisher:   Chapman and Hall
Imprint:   Chapman and Hall
Edition:   2nd ed. 1999
Dimensions:   Width: 15.50cm , Height: 2.30cm , Length: 23.50cm
Weight:   1.700kg
ISBN:  

9780412725609

ISBN 10:   0412725606
Pages:   404
Publication Date:   30 April 1999
Audience:   College/higher education ,  Professional and scholarly ,  Postgraduate, Research & Scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

List of Contributors. Preface. 1. Introduction to Polymers and Their Important Properties for Electronic Applications; M. Goosey. 2. Silicone Materials for Electronic Components and Circuit Protection; J.-P. Mollie. 3. Engineering Thermoplastics; H. van Baal. 4. Epoxide Resins and Their Formulation; M. Goosey, et al. 5. Recent Developments in the Encapsulation of Semiconductors by Transfer Moulding; M. Goosey, M. Plant. 6. Materials for Advanced Encapsulation; N. Hackett. 7. Recent Developments in the Chemistry of Lithography for Electronics Production; D. Merricks. 8. Ferroelectric Polymers; J.A. Chilton. 9. Polymers in Printed Circuit Board (PCB) and Related Advanced Interconnect Applications; M. Goosey. 10. New Polymers for Emerging Interconnect Applications; J. Everett, et al. 11. Moulded Interconnect Devices (MIDs); F. Pöhlau, K. Feldmann.

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