Overview

This volume reviews the practical aspects of electrical and thermal modelling of GaAs wireless applications, discussing analogue (microwave) packaging as opposed to digital packaging. It emphasizes low-cost industry-standard packages; however, the principles translate well to other categories of packages. The need for this book arises from the fact that low-cost packages have not been optimized for high-frequency use. With high-volume commercial wireless markets now expanding and cost reduction a primary concern, the interest in modelling as a significant cost-cutting tool is high. This text addresses this interest and need, providing a comprehensive approach to the state-of-the-art modeling and processing techniques that professional engineers are just beginning to utilize. Engineers and professionals in the field of wireless packaging should find this book interesting and of value to their work.

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