New Techniques for Characterizing Corrosion and Stress Corrosion

Author:   R.H. Jones ,  D.R. Baer
Publisher:   The Minerals, Metals & Materials Society
Edition:   illustrated edition
ISBN:  

9780873393256


Pages:   331
Publication Date:   01 August 1998
Format:   Hardback
Availability:   In Print   Availability explained
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New Techniques for Characterizing Corrosion and Stress Corrosion


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Overview

Researchers in the fields of surface science, materials science, corrosion and electrochemistry should find this volume to be a useful reference source on recent developments and techniques in the study and understanding of corrosion and stress corrosion. The 21 papers are organized into the following topics: analytical, theoretical and computational, crack growth and electrochemical. Coverage includes: application of scanning tunnelling microscope and quartz crystal microbalance for study of inhibitor adsorption metals; atomistic simulation of the hydrogen-induced fracture process in an iron-based superalloy; the effect of environment on fatigue crack top micromechanics; and a review of electrochemical noise and its application to the study of stress corrosion cracking.

Full Product Details

Author:   R.H. Jones ,  D.R. Baer
Publisher:   The Minerals, Metals & Materials Society
Imprint:   The Minerals, Metals & Materials Society
Edition:   illustrated edition
ISBN:  

9780873393256


ISBN 10:   0873393252
Pages:   331
Publication Date:   01 August 1998
Audience:   College/higher education ,  Professional and scholarly ,  Postgraduate, Research & Scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

Part 1 Analytical techniques: application of scanning tunneling microscope and quartz crystal microbalance for study of inhibitor adsorption on metals, H.W. Pickering et al; application of valence band photoelectron spectroscopic data to the understanding of environment/material interactions, P.M.A. Sherwood; in-situ laser Raman and infrared spectroscopic studies of anodic corrosion films metals, C.A. Melendres; an environmental cell TEM for studies of gas-solid interactions, D.F. Teter et al; defect generation and interactions with small molecules on the rutile TiO2 (110) surface in vacuum and solution, D.R. Baer et al. Part 2 Theoretical and computational methods: atomistic simulation of the hydrogen-induced fracture process in an iron-based superalloy, N.R. Moody et al; atomistic modelling of the competition between dislocation emission and crack extension-relevance to environmental assisted cracking, R.G. Hoagland; the SAM mechanism of corrosion inhibition for iron surfaces, S. Ramachandran et al; AFM measurements and micromechanics modelling of corrosion fatigue, W.W. Gerberich et al; a transport model for characterizing crack-tip chemistry and mechanics during stress corrosion cracking, E.P. Simonen et al. Part 3 Crack growth measurements: the effect of environment on fatigue crack-tip micromechanics, D.L. Davidson; high-resolution analytical electron microscopy of intergranular stress corrosion cracks, L.E. Thomas et al; advanced techniques for characterization of electrochemical effects in stress corrosion cracks, P.L. Andresen; effect of loading mode on hydrogen embrittlement and aqueous stress-corrosion crack growth, H. Li et al. Part 4 Electrochemical techniques: a review of electrochemical noise and its application to the study of stress-core cracking, R.E. Ricker and U. Bertocci; the application of radiotracer method for the study of anion accumulation on stainless steel and aluminium surfaces, A. Kolics et al; photoelectrochemistry for non-destructive, in-situ characterization of corroding metals, T.D. Burleigh; an analysis of biofilm layers associated with microbially-induced corrosion using FT-IR spectroscopy, C. Nail; effects of anodic dissolution on diffusion in Cu/Ag thin film couples, D.A. Jones et al. (Part contents)

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