Overview
Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Full Product Details
Author: James E. Morris ,
Debendra Mallik
Publisher: Springer-Verlag New York Inc.
Imprint: Springer-Verlag New York Inc.
Edition: 2009
Dimensions:
Width: 15.50cm
, Height: 3.10cm
, Length: 23.50cm
Weight: 1.016kg
ISBN: 9780387473253
ISBN 10: 0387473254
Pages: 543
Publication Date: 23 October 2008
Audience:
Professional and scholarly
,
Professional & Vocational
Replaced By: 9783319903613
Format: Hardback
Publisher's Status: Active
Availability: In Print
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Reviews
From the reviews: This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. ... I am pleased to be able to conclude this ... Nanopackaging: Nanotechnologies and Electronics Packaging as 'highly recommended,. (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009)
From the reviews: This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. ! I am pleased to be able to conclude this ! Nanopackaging: Nanotechnologies and Electronics Packaging as 'highly recommended'. (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009)
From the reviews: This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. ... I am pleased to be able to conclude this ... Nanopackaging: Nanotechnologies and Electronics Packaging as 'highly recommended'. (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009)
