Modern EMC Analysis Techniques Volume I: Time-Domain Computational Schemes
Author:   Nikolaos V. Kantartzis ,  Theodoros D. Tsiboukis
Publisher:   Springer International Publishing AG
ISBN:  

9783031005770


Pages:   224
Publication Date:   20 June 2008
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Modern EMC Analysis Techniques Volume I: Time-Domain Computational Schemes


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Author:   Nikolaos V. Kantartzis ,  Theodoros D. Tsiboukis
Publisher:   Springer International Publishing AG
Imprint:   Springer International Publishing AG
Weight:   0.452kg
ISBN:  

9783031005770


ISBN 10:   3031005775
Pages:   224
Publication Date:   20 June 2008
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.
Language:   English

Table of Contents

Fundamental Time-Domain Methodologies for EMC Analysis.- Alternative Time-Domain Techniques in EMC Modeling.- Principal Implementation Issues of Time-Domain EMC Simulation.

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Author Information

Nikolaos V. Kantartzis received the Diploma degree and Ph.D. degree in electrical and computer engineering from the Aristotle University of Thessaloniki (AUTH), Thessaloniki, Greece, in 1994 and 1999, respectively. In 1999, he joined the Applied and Computational Electromagnetic Laboratory, Department of Electrical and Computer Engineering, AUTH, as a Postdoctoral Research Fellow. He has authored or coauthored several refereed journal papers in the area of computational electromagnetics and especially higher order finite-difference time-domain (FDTD) method, perfectly matched layers (PMLs), nonorthogonal discretization algorithms, vector finite elements and alternating-direction implicit (ADI) formulations. His main research interests include time- and frequency-domain electromagnetic and acoustic analysis, EMC modeling, modern microwave circuits, antenna structures and metamaterials.

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