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OverviewA lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique. Full Product DetailsAuthor: Lucas F. M. da Silva , Andreas OchsnerPublisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Imprint: Springer-Verlag Berlin and Heidelberg GmbH & Co. K Edition: Softcover reprint of hardcover 1st ed. 2008 Dimensions: Width: 15.50cm , Height: 1.80cm , Length: 23.50cm Weight: 0.534kg ISBN: 9783642097898ISBN 10: 3642097898 Pages: 335 Publication Date: 19 October 2010 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: In Print ![]() This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsAnalytical Modeling.- Simple Lap Joint Geometry.- Analysis of Cracked Lap Shear (CLS) Joints.- Analytical Models with Stress Functions.- Numerical Modeling.- Complex Constitutive Adhesive Models.- Complex Joint Geometry.- Progressive Damage Modelling.- Modelling Fatigue in Adhesively Bonded Joints.- Environmental Degradation.- Non-Linear Thermal Stresses in Adhesive Joints.- Impact.- Stress Analysis of Bonded Joints by Boundary Element Method.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |