Overview
Drawn from presentations at a recent National Science Foundation Summer Institute on Nanomechanics, Nanomaterials, and Micro/Nanomanufacturing, Micro- and Nanoscale Phenomena in Tribology explores the convergence of the multiple science and engineering disciplines involved in tribology and the connection from the macro to nano world. Written by specialists from computation, materials science, mechanical engineering, surface physics, and chemistry, each chapter provides up-to-date coverage of both basic and advanced topics and includes extensive references for further study. After discussing the evolution of tribology in the micro and nano world, the book describes contact conditions spanning between macroscale and nanoscale contacts. It presents an overview of fundamental continuum treatments of interfacial contact and lubrication under a wide range of conditions, including novel advances in contact simulation. It also gives a thorough account of the nature of surface energies and forces in nanostructures as well as adhesion in dry and wet environments. The book then explains how to perform friction measurements at the nanoscale and interpret friction data before demonstrating how micro- and nanotextured surfaces affect adhesion, friction, and wetting. The final chapters emphasize the importance of surface chemistry and molecular dynamics simulation in tribology. With numerous examples and figures throughout, this volume presents a thorough account of important advancements in tribology that offer insight into micro- and nanoscale phenomena. By enabling a better understanding of fundamental micro- and nanoscale interactions, the book helps readers effectively design and fabricate durable tribological components for various engineering and biological systems.
Full Product Details
Author: Yip-Wah Chung (Northwestern University, Evanston, Illinois, USA)
Publisher: Taylor & Francis Inc
Imprint: CRC Press Inc
Dimensions:
Width: 15.60cm
, Height: 2.00cm
, Length: 23.40cm
Weight: 0.498kg
ISBN: 9781439839225
ISBN 10: 1439839220
Pages: 222
Publication Date: 19 October 2011
Audience:
College/higher education
,
General/trade
,
Tertiary & Higher Education
,
General
Format: Hardback
Publisher's Status: Active
Availability: In Print
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Author Information
Yip-Wah Chung is a professor of materials science and engineering and mechanical engineering at Northwestern University. A fellow of ASM International, AVS, and STLE, Dr. Chung has received numerous honors, including the Ralph A. Teetor Engineering Educator Award from SAE, the Innovative Research Award and Best Paper Award from the ASME Tribology Division, and the Bronze Bauhinia Star from the Hong Kong Special Administrative Government. He earned a Ph.D. in physics from the University of California, Berkeley. His research interests encompass surface science, tribology, thin films, and alloy design.
