Overview

This text chronicles the proceedings of the 5th and 6th symposia on ""Metallized Plastics: Fundamental and Applied Aspects"", held in May 1996 and September 1997. It contains 29 papers divided into three sections: Metallization Techniques and Properties of Metal Deposits; Spectroscopic Investigation of Interfacial Interactions; and Surface Modification and Adhesion Aspects.

Full Product Details

Author:   Kash L. Mittal
Publisher:   Brill
Imprint:   VSP International Science Publishers
Dimensions:   Width: 17.80cm , Height: 2.70cm , Length: 25.40cm
Weight:   0.915kg
ISBN:  

9789067642903

ISBN 10:   9067642908
Pages:   438
Publication Date:   01 October 1998
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Out of Print
Availability:   Out of stock  

Table of Contents

Preface PART 1. METALLIZATION TECHNIQUES AND PROPERTIES OF METAL DEPOSITS Electroless metallization of polymers: Simplification of the process by using plasma or UV-laser pretreatment; Pulsed laser deposition of TiN on PMMA and polyimide: A novel route for polymer metallization; Metallization of polymers using plasma enhanced chemical vapor deposited titanium nitride as interlayer; Deposition of tribological hard coatings on plastics by reactive gas flow sputtering; Substrate heating during sputter coating of polymers; High rate coating of plastic films and plastic sheets with clear oxide layers; Physical and chemical surface preconditioning and metallization of thermoplastics for electronic components; New generation sputtering and plasma polymerization plant for metallization of plastics; Electrodeposition of copper on PVC using soluble polyaniline; Study of mechanism of direct copper plating onto nonconductors via Pd/Sn activation and sulfur promotion; A dual-reaction mechanism for direct copper plating on nonconductors via Pd activation and sulfur promotion; Economical selective metallization of insulating surfaces; Plastics metallization using a dynamic chemical plating process; PART 2. SPECTROSCOPIC INVESTIGATION OF INTERFACIAL INTERACTIONS The application of Near Edge X-ray Absorption Fine Structure (NEXAFS) spectroscopy and X-ray Photoelectron Spectroscopy (XPS) in surface analysis of chromium-evaporated polymers and organic films; Penetration of deposited Au, Cu, and Ag overlayers through alkanethiol self-assembled monolayers on gold or silver; An in-situ X-ray photoelectron study of the interaction between vapor-deposited A1 atoms and hydroxyl or amine terminated self-assembled monolayers; Early stages of copper/polyimide interface formation; The spontaneous reaction of Cu (hfac) (TMVS) vapor with Dupont Teflon AF1600; The deposition of copper onto Teflon AF1600: An XPS comparison of vapor deposition and sputtering; Bulk and interface degradation processes in polymer electroluminescent devices; PART 3. SURFACE MODIFICATION AND ADHESION ASPECTS Plasma pretreatment of polymer surfaces - Relevance to adhesion of metals; Study of the He-NH3 plasma mixtures and their role in the stability of the plasma treated polypropylene surface; Plasma pretreatment for metallization of polyimides: Effect of plasma system configuration; Surface modification of polymers used in the Low Earth Orbit space environment; Metal adhesion enhancement by pretreatment of poly(butylene terephthalate) surfaces with excimer laser radiation; Ion beam induced adhesion at metal-polymer interfaces; Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment; A quantitative adhesion test for metal coated polymer fibres; Non-destructive techniques for monitoring metallized plastics adhesion

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