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OverviewFull Product DetailsAuthor: Edward SacherPublisher: Springer Science+Business Media Imprint: Kluwer Academic/Plenum Publishers Edition: 2002 ed. Dimensions: Width: 17.80cm , Height: 2.00cm , Length: 25.40cm Weight: 1.080kg ISBN: 9780306472534ISBN 10: 0306472538 Pages: 208 Publication Date: 30 September 2002 Audience: College/higher education , Professional and scholarly , Postgraduate, Research & Scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print ![]() This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsNew Instrumentation.- 1. Surface Analysis Using Confocal Raman Micro-spectroscopy.- 2. Ellipsometric Characterization of the Optical Constants of Metals: Thin Film versus Nanoparticle.- 3. Ultra Thin Film Analysis Using the Thermo VG Scientifics Thetaprobe Instrument.- 4. Nanoindentation of Microsprings and Microcantilevers.- Low Permittivity Materials.- 5. Physical and Interfacial Properties of Low Permittivity Polymers: Cyclotene, SiLK and Ultra-Low K.- 6. Mechanical Properties of Cured Silk Low-K Dielectric Films.- 7. Plasma-Polymerized Fluoropolymer Thin Films for Microelectronic Applications.- Polymer Metallization.- 8. Fundamental Aspects of Polymer Metallization.- 9. The Study of Copper Clusters on Dow Cyclotene and Their Stability.- 10. Adsorption of Noble Metal Atoms on Polymers.- 11. Nucleation and Growth of Vapor-Deposited Metal Films on Self-Assembled Monolayers Studied by Multiple Characterization Probes.- Barrier Layers.- 12. Morphological Investigations of Low-k Polymer/Diffusion Barrier Interfaces for IC Metallization.- 13. Chemistry in the Initial Formation of Nitride Barriers on Low-K Dielectrics.- 14. Capabilities and Limitations of RBS to Characterize Hyper-Thin Silicon Compound on Various Polymeric Substrates.- Adhesion Enhancement.- 15. Surface Modifications by Ion-Assisted Reactions.- 16. Plasma and VUV Pretreatments of Polymer Surfaces for Adhesion Enhancement of Electrolessly Deposited Ni or Cu Films.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |