Metal Impurities in Silicon-Device Fabrication

Author:   Klaus Graff ,  H.-J. Queisser
Publisher:   Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Edition:   Second Edition 2000
Volume:   24
ISBN:  

9783540642138


Pages:   270
Publication Date:   18 February 2000
Format:   Hardback
Availability:   In Print   Availability explained
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Metal Impurities in Silicon-Device Fabrication


Overview

Metal Impurities in Silicon-Device Fabrication treats the transition-metal impurities generated during the fabrication of silicon samples and devices. The different mechanisms responsible for contamination are discussed, and a survey is given of their impact on device performance. The specific properties of the main and rare impurities in silicon are examined, as well as the detection methods and requirements in modern technology. Finally, impurity gettering is studied along with modern techniques to determine the gettering efficiency. In all of these subjects, reliable and up-to-date data are presented. This monograph provides a thorough review of the results of recent scientific investigations, as well as the relevant data and properties of the various metal impurities in silicon. The new edition includes important recent data and a number of new tables.

Full Product Details

Author:   Klaus Graff ,  H.-J. Queisser
Publisher:   Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Imprint:   Springer-Verlag Berlin and Heidelberg GmbH & Co. K
Edition:   Second Edition 2000
Volume:   24
Dimensions:   Width: 15.50cm , Height: 1.50cm , Length: 23.50cm
Weight:   0.606kg
ISBN:  

9783540642138


ISBN 10:   3540642137
Pages:   270
Publication Date:   18 February 2000
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

1. Introduction.- 2. Common Properties of Transition Metals.- 2.1 General Behavior.- 2.2 Contamination of Silicon Wafers.- 2.3 Impact on Device Performance.- 3. Properties of Transition Metals in Silicon.- 3.1 Solubilities.- 3.2 Diffusivities.- 3.3 Dissolved Impurities.- 3.4 Precipitated Metals.- 4. Properties of the Main Impurities.- 4.1 Iron.- 4.2 Nickel.- 4.3 Copper.- 4.4 Molybdenum.- 4.5 Palladium.- 4.6 Platinum.- 4.7 Gold.- 5. Properties of Rare Impurities.- 5.1 Scandium.- 5.2 Titanium.- 5.3 Vanadium.- 5.4 Chromium.- 5.5 Manganese.- 5.6 Cobalt.- 5.7 Zinc.- 5.8 Zircon.- 5.9 Niobium.- 5.10 Ruthenium.- 5.11 Rhodium.- 5.12 Silver.- 5.13 Cadmium.- 5.14 Hafnium.- 5.15 Tantalum.- 5.16 Tungsten.- 5.17 Rhenium.- 5.18 Osmium.- 5.19 Iridium.- 5.20 Mercury.- 6. Detection Methods.- 6.1 Detection of Total Impurity Content.- 6.2 Detection of Dissolved Impurities.- 6.3 Detection of Precipitates.- 7. Requirements of Modern Technology.- 7.1 Reduction of Contamination.- 8. Gettering of Impurities.- 8.1 Gettering Mechanisms.- 8.2 Control of Gettering Efficiency.- 9. Conclusion and Future Trends.- References.

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