Overview

Mechanics of Bonded and Adhesively Bonded Joints provides an overview of the most effective analytical solutions for common bonded and adhesively bonded joints. In each type of joint analyzed, the analytical stress solution is formulated and final numerical results are provided for easy use and self-learning. Analytical and high-efficiency semianalytical methods for interfacial stress and fracture analysis of various bonded and adhesively bonded joints are provided as are related joint design insights and advanced applications in structures and devices. Fundamentals of elasticity, fracture mechanics, and viscoelasticity are also introduced. The book starts by introducing different kinds of joining technology and how joints are classified, followed by chapters looking at the fundamentals of elasticity and fracture mechanics. From there the book explores various analytical solutions to interfacial stresses, strength and toughness of bonded joints, and the viscoelastic mechanics of adhesives and concludes with a chapter covering the applications of these joining theories, exploring their use in smart materials, microelectronics packaging, surface coatings, laminated composite materials, and more.

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9780323951449

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Xiangfa Wu is a full professor in the Department of Mechanical Engineering at North Dakota State University (NDSU), USA. He was previously a lecturer in the Department of Flight Engineering at Beijing Institute of Technology (China), a research assistant professor in the Department of Engineering Mechanics at University of Nebraska-Lincoln (USA). Since 2008 at NDSU, he and his research group have conducted 16 research projects founded by NSF, DOE, DOD, NASA, and local state and regional funding agencies in the fields of solid mechanics, self-healing composites, nanofibers, energy harvesting, conversion and storage, environmental protection, and more. He has taught undergraduate and graduate courses on Statics, Dynamics, Mechanics of Materials, Fracture Mechanics, Vehicle Dynamics, Numerical Methods, Smart Materials and Structures, Nanocomposites, Machine Design, among others, and is a member of ASME.

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